Patent ZL2010 0697613.2 ZL2008 2 3 0102947.9



Low floor center temperature 25 ° C or less power rating of 35 w

Low surface mount (SMD) molded the TO - 220 encapsulation
After add heat sink, thermal resistance Rth < 4.28 ° K/W.
Low affordable reflow soldering temperature of 270 ° C / 10 s
Low insulation part and metal base plate
Low pulse load capacity can be seen in "EBG resistor pulse electric power load characteristic"